NOT KNOWN FACTS ABOUT MONOCRYSTALLINE SILICON

Wire-saw wafer slicing is probably the key generation technologies for industrial crystalline silicon PV cells, and enhancements in wafer slicing technology have resulted in a discount in raw wafer thickness from 370 μm to 180 μm considering the fact that 1997 for Sharp industrial polycrystalline-silicon cells (Figure 6). To introduce wafers thin